LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array semiconductor package with improved strength...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array semiconductor package with resin coated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array socket having improved housing

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array structure and method for packaging an integrated

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball grid array structure and method for packaging an integrated

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array structures and tape-based method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid array structures and tape-based method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Ball grid array substrate having window and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball grid array type package for semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Ball grid array type printed wiring board having exellent...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball grid array type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid assembly with solder columns

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball grid package with multiple power/ground planes

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part

Ball-grid-array semiconductor device with protruding terminals

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Ball-grid-array-type semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball-grid-array-type semiconductor device and its...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Ball-less clip bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Barrier layers for thin film electronic materials

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Barrier structure against corrosion and contamination in...