Ball grid array type semiconductor device

Details Ball grid array type semiconductor device Ball grid array type semiconductor device

1995-09-01

1997-01-21

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257702, 257774, 257787, H01L 2312

Patent

active

055962270

ABSTRACT:
A mother board has wiring patterns formed on the front and rear surfaces thereof. A solder ball is formed on an island at the end of each wiring pattern on the rear surface. Vias are formed in the mother board, surrounding an LSI mount area of the board. An LSI chip mounted on the mother board is sealed by a front surface sealing resin layer. A rear surface sealing resin layer having substantially the same size and thickness as those of the front surface sealing resin is molded on the rear surface of the mother board at the position registered to the front surface sealing resin layer. The front and rear surface sealing resin layers are integrally formed through the vias. Resin layers in the vias function as anchors for integrating the upper and lower sealing resin layers. Semiconductor devices of a resin molded type are provided which can improve reliability.

REFERENCES:
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5394298 (1995-02-01), Sagisaka
Nikkei Electronics 1994 Feb. 14 issue--pp. 60-73.
Nikkei Electronics 1994 Feb. 28 issue--pp. 111-117.

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