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Solid-state chip cooling by use of microchannel coolant flow

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Solid-state image pickup apparatus and fabricating method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Reexamination Certificate

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Solid-state image pickup device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Solid-state image sensing apparatus and manufacturing method the

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Patent

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Solid-state image sensing apparatus and package of same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Solid-state imaging device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Solid-state imaging device, method for producing same, and mask

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Reexamination Certificate

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Space-saving packaging of electronic circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Spacer die structure and method for attaching

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Spacer for mounting a chip package to a substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Spacer with passive components for use in multi-chip modules

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Spherical semiconductor device and method of mounting the...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Split-mold and method for manufacturing semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Reexamination Certificate

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Splitting and assigning power planes

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Spontaneous emission enhanced heat transport method and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Spring connector for making electrical contact at...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Spring frame for protecting packaged electronic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Stabilizers for flip-chip type semiconductor devices and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate

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Stack arrangement of a memory module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Stack arrangements of chips and interconnecting members

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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