Solid-state imaging device, method for producing same, and mask

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Reexamination Certificate

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Details

C257S686000, C257S777000, C257S787000, C257S460000, C257S431000, C438S116000, C438S106000, C438S025000, C438S026000

Reexamination Certificate

active

06873034

ABSTRACT:
The present invention provides a solid-state imaging device comprising: a transparent substrate transmitting light therethrough; a first chip including a solid-state imaging element having a light receiving portion; a first resin providing airtight sealing between the first chip and the transparent substrate; a second chip opposite to the transparent substrate with respect to the first chip; and second resin die bonding the second chip to the first chip, wherein the first resin and the second resin are made of the same material.

REFERENCES:
patent: 5729038 (1998-03-01), Young et al.
patent: 6472247 (2002-10-01), Andoh et al.
patent: 6498115 (2002-12-01), Yumoto
patent: 20040018662 (2004-01-01), Goto
patent: 6-204442 (1994-07-01), None
patent: 10-256470 (1998-09-01), None
patent: 11224883 (1999-08-01), None
patent: 11251340 (1999-09-01), None
patent: 2002280400 (2002-09-01), None
patent: WO 9702596 (1997-01-01), None

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