Solid-state image sensing apparatus and package of same

Details Solid-state image sensing apparatus and package of same Solid-state image sensing apparatus and package of same

2011-01-11

2011-01-11

Purvis, Sue (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257SE23048

Reexamination Certificate

active

07868447

ABSTRACT:
Warpage and twist of a solid-state image sensing apparatus is controlled, thereby preventing displacement occurring to the solid-state image sensing apparatus when it is mounted on a printed circuit board. The solid-state image sensing apparatus comprises a plurality of outer leads, and the outer leads each comprises a horizontal portion protruding in the horizontal direction from a side face of a package body for encasing a solid-state image sensing chip therein, an end portion extending in a direction orthogonal to the horizontal portion, and disposed directly below the horizontal portion, a mid portion positioned between the horizontal portion, and the end portion, a first bend formed between the horizontal portion, and the mid portion, and a second bend formed between the mid portion, and the end portion.

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