Spacer with passive components for use in multi-chip modules

Details Spacer with passive components for use in multi-chip modules Spacer with passive components for use in multi-chip modules

2005-08-23

2005-08-23

Zarneke, David A. (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

Reexamination Certificate

active

06933597

ABSTRACT:
A method for providing passive circuit functions in a multi-chip module and the multi-chip modules that result from incorporating these function is disclosed. Passive components such as resistors, capacitors and inductors are fabricated on or within a non-conductive spacer. The spacer is then placed between two active semiconductor dies and coupled electrically to either one or both of the dies. In this manner, area of the active dies that would normally have to be used for such passive components is freed for other uses and the spacer, which was already required in multi-chip modules, is endowed with extra functionality. In another embodiment, one or both surfaces of the spacer are coated with a conductive metal and the passive components are located within the spacer. In this embodiment, the spacer provides electromagnetic interference protection between the active dies.

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patent: 6671947 (2004-01-01), Bohr
patent: 6861288 (2005-03-01), Shim et al.

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