4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
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System-on-a-chip with multi-layered metallized through-hole...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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System-on-a-chip with multi-layered metallized through-hole...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Systems and methods for stacking chip components

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Systems and methods for testing packaged dies

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Systems for buried electrical feedthroughs in a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With semiconductor element forming part
Reexamination Certificate

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Systems for testing and packaging integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Systems having advanced pre-formed planar structures

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Systems having modules with selectable on die terminations

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Systems interconnected by bumps of joining material

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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