Standoffs for centralizing internals in packaging process
Stereolithographic method for fabricating heat sinks,...
Stiffener for flip chip BGA package
Stiffener ring and heat spreader for use with flip chip packagin
Stiffener ring attachment with holes and removable snap-in heat
Stiffener with slots for clip-on heat sink attachment
Stiffeners with improved adhesion to flexible substrates
Stitched plane structure and process for package power...
Storage apparatus, card type storage apparatus, and...
Storage apparatus, card type storage apparatus, and...
Strain release contact system for integrated circuits
Stray field shielding structure for semiconductors
Strengthened window-type semiconductor package
Stress clip design
Stress reducing stiffener ring
Stress reduction for flip chip package
Stress relieving film for semiconductor packages
Stress-free silicon wafer and a die or chip made therefrom...
Stress-relieving heatsink structure and method of attachment...
Structural reinforcement for electronic substrate