Stiffener ring and heat spreader for use with flip chip packagin

Details Stiffener ring and heat spreader for use with flip chip packagin Stiffener ring and heat spreader for use with flip chip packagin

1997-09-26

1999-09-07

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257213, 257797, 257718, 257726, 257727, 257704, 257783, 257785, 361764, 29832, 29840, H05K 710, H01L 2334, H01L 2328

Patent

active

059491370

ABSTRACT:
A stiffener device for use with a flip chip packaging assembly including a generally rectangular, plate-like member having a substantially uniform thickness. At each of the rectangular plate-like member is a curved chamfer portion extending from an upper surface to a lower surface thereof, and defined by a chamfer edge commencing at one side edge forming the respective corner and terminating at an opposite side edge of the respective corner. Each curved chamfer portion is adapted to receptively accommodate a respective mounting bolt therethrough. The fabrication of the stiffener device is formed from a single stamping or punching operation in a manner maintaining a substantially planar upper surface and lower surface.

REFERENCES:
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patent: 5789812 (1998-08-01), Takahashi
patent: 5805418 (1998-09-01), Salmonson et al.

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