Stress relieving film for semiconductor packages

Details Stress relieving film for semiconductor packages Stress relieving film for semiconductor packages

2007-03-06

2007-03-06

Huynh, Andy (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S706000, C257S796000

Reexamination Certificate

active

10903680

ABSTRACT:
Techniques for reducing the mechanical stress imposed upon semiconductor dice by protective molding compounds during times of temperature fluctuation. A thermoplastic material is attached to a top surface of a die to relieve the stress. The thermoplastic material serves as a cushion between the die and the molding compound when the components expand and contract. The thermoplastic material can be shaped such that it does not cover bond pads on the surface of a die.

REFERENCES:
patent: 4511483 (1985-04-01), Ogawa et al.
patent: 5256564 (1993-10-01), Narita
patent: 6225703 (2001-05-01), Umehara et al.
patent: 6744133 (2004-06-01), Tanabe et al.
patent: 2003/0012882 (2003-01-01), Tokuhisa et al.
patent: 2005/0246879 (2005-11-01), Kamimura et al.

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