Assembly for mounting an electronic device having an optically e
Bi-level microelectronic device package with an integral window
Ceramic package for memory semiconductor
Cerdip type of solid-state image sensing device, structure...
Cerdip type of solid-state image sensing device, structure...
Chip on board package for imager
Chip package substrate having soft circuit board and method...
Chip package with a ring having a buffer groove that...
Device with integrated circuit protected against attacks...
Dynamic random access memory having a stacked fin capacitor with
Electronic device and semiconductor device
Electronic device having a multiplicity of contact bumps
Electronic device packaging
Electronic memory device having a non-peripheral contact for rea
Electronic package with offset reference plane cutout
Electronic part and its manufacturing method
Embedded wiring board, semiconductor package including the...
Encapsulants for protecting MEMS devices during...
EPROM package and method of optically erasing
FBGA and COB package structure for image sensor