FBGA and COB package structure for image sensor

Details FBGA and COB package structure for image sensor FBGA and COB package structure for image sensor

2007-10-09

2007-10-09

Ha, Nathan W. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With window means

Reexamination Certificate

active

11029929

ABSTRACT:
A structure of package comprises a die placed on printed circuit board. A glass substrate is adhered on an adhesive film pattern to form an air gap area between the glass substrate and the chip. Micro lens are disposed on the chip. A lens holder is fixed on printed circuit board. The glass substrate can prevent the micro lens from particle contamination.

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