4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With window means
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FBGA and COB package structure for image sensor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Reexamination Certificate

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Flip-chip image sensor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means
Reexamination Certificate

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