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Semiconductor device in a resin sealed package with a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Semiconductor device manufacturing method, semiconductor...

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Semiconductor device mounted on a heat sink with an intervening

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Semiconductor device package having a thermal dissipation means

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Semiconductor device package with improved cooling

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Semiconductor device reducing warping due to heat production

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Semiconductor device structure including bending-resistant radia

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Semiconductor device which dissipates heat

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Semiconductor device with a high thermal dissipation efficiency

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Semiconductor device with an airtight space formed internally wi

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Semiconductor device with cooling element

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Semiconductor device with first and second sealing resins

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Semiconductor device with heat dissipation metal layer and metal

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Semiconductor device with heat sink including positioning pins

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Semiconductor device with improved heat dissipation, and a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Semiconductor device with pipe for passing refrigerant liquid

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Semiconductor device with plated heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Semiconductor device with source/drain extension layer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Semiconductor device with temperature control mechanism

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
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Semiconductor device, image scanning unit and image forming...

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