Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-09-26
2006-09-26
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257SE33075, C257SE31131, C257SE23051, C257SE23021, C257SE23079, C257SE23114, C257SE25013, C257SE23069, C257S734000, C257S738000, C257S737000, C257S772000, C257S778000, C257S712000, C257S713000, C257S717000, C257S675000, C257S721000, C257S722000, C257S719000, C257S706000, C257S668000
Reexamination Certificate
active
07112883
ABSTRACT:
A semiconductor device is provided, the semiconductor device including a semiconductor chip having a first metal heat-conductive medium in the inside thereof, a substrate having a second metal heat-conductive medium thermally connected to the first metal heat-conductive medium, and a temperature control device of which at least a part is disposed on the substrate, thermally connected to the second metal heat-conductive medium, and configured to control the temperature within the semiconductor chip.
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Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Kabushiki Kaisha Toshiba
Williams Alexander Oscar
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