Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2004-04-23
2008-12-30
Williams, Alexander O (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257SE23110, C257S706000, C257S707000, C257S712000, C257S675000, C257S678000
Reexamination Certificate
active
07470983
ABSTRACT:
A semiconductor device includes an intermediate layer provided between a semiconductor element and a heat sink. The intermediate layer moderates thermal stress resulting from a difference between thermal expansion of the semiconductor element and thermal expansion of the heat sink arising due to heat produced by the semiconductor element. This thermal stress moderation reduces warping of the semiconductor device as a whole.
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Hachisuka Kimio
Takano Fumitomo
Tsukada Yoshinari
Yamanaka Yasuro
Yarita Hiroshi
Honda Motor Co. Ltd.
Rankin , Hill & Clark LLP
Williams Alexander O
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