Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1996-05-16
1997-07-01
Crane, Sara W.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257675, 257796, H01L 2334
Patent
active
056441649
ABSTRACT:
A semiconductor device includes a package accommodating a semiconductor chip, and a plurality of connecting leads. One end portion of each connecting lead being attached to the semiconductor chip by an adhesive member and the other end portion thereof being external to the package and connected to a circuit substrate. The semiconductor device further includes at least one heat-emitting lead whose one end portion is attached to the semiconductor chip by the adhesive member and whose other end portion is external to the package and is separated from the circuit substrate. The semiconductor device also includes a heat-emitting body inserted into the adhesive member and having one portion thereof connected to the heat-emitting lead.
REFERENCES:
patent: 5047837 (1991-09-01), Kitano et al.
patent: 5073817 (1991-12-01), Ueda
patent: 5093713 (1992-03-01), Sawaya
patent: 5220486 (1993-06-01), Takubo et al.
patent: 5365107 (1994-11-01), Kuraishi et al.
patent: 5488254 (1996-01-01), Nishimura
Cao Phat X.
Crane Sara W.
Samsung Aerospace Industries Ltd.
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