Semiconductor device with first and second sealing resins

Details Semiconductor device with first and second sealing resins Semiconductor device with first and second sealing resins

1996-06-20

1997-12-16

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257675, 257790, 257796, 257706, 257709, 257717, 257720, H01L 2302, H01L 2330

Patent

active

056988990

ABSTRACT:
It is an object to increase a breakdown voltage of a lead frame. A primary sealing resin (41) seals the upper main surface of a lead frame (3) and elements mounted thereon. A secondary sealing resin (21) coupling the lead frame (3) and a heat sink (51) passes through gaps of the lead frame (3) having pattern configuration to project on the upper main surface side of the lead frame (3). The primary sealing resin (41) is in close contact with the projections (62). The projections (62) enlarge the creeping distance along the interface between the primary sealing resin (41) and the secondary sealing resin (21) between parts of the lead frame (3) adjacent with gaps therebetween, so that the breakdown voltage between those parts is increased.

REFERENCES:
patent: 3930114 (1975-12-01), Hodge
patent: 5430331 (1995-07-01), Hamzehdoost et al.
patent: 5442234 (1995-08-01), Liang
patent: 5530295 (1996-06-01), Mehr

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