Semiconductor device with cooling element

Details Semiconductor device with cooling element Semiconductor device with cooling element

2010-03-10

2011-12-06

Le, Thao P. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S722000

Reexamination Certificate

active

08072061

ABSTRACT:
Some embodiments discussed herein include a semiconductor having a source region, a drain region and an array of fins operatively coupled to a gate region controlling current flow through the fins between the source region and the drain region. The semiconductor also has at least one cooling element formed at least in part of a material having a heat capacity equal to or larger than the heat capacity of the material of the source region, drain region and array of fins, the cooling elements being in close vicinity to fins of the array of fins electrically isolated from the fins of the array, the source region and the drain region.

REFERENCES:
patent: 5850099 (1998-12-01), Liu
patent: 2002/0033189 (2002-03-01), Macris
patent: 2003/0160233 (2003-08-01), Rendon et al.
patent: 2003/0189231 (2003-10-01), Clevenger et al.
patent: 2004/0150029 (2004-08-01), Lee
patent: 2005/0133829 (2005-06-01), Kunii et al.
patent: 2005/0167849 (2005-08-01), Sato
patent: 2007/0010049 (2007-01-01), Anderson et al.
patent: 2007/0023892 (2007-02-01), Gauche et al.
patent: 2008/0111163 (2008-05-01), Russ et al.

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