Semiconductor device with an airtight space formed internally wi

Details Semiconductor device with an airtight space formed internally wi Semiconductor device with an airtight space formed internally wi

1993-11-22

1994-08-30

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257700, 257704, 257710, 257711, 257690, 257741, H01L 2348, H01L 2302, H01L 2312, H01L 2940

Patent

active

053430760

ABSTRACT:
This invention relates to a package construction of a semiconductor device, and provides a semiconductor device in which a vapor-impermeable moistureproof plate is embedded in a bottom surface of a hollow package or an inner surface wallthicknesswise therefrom to provide an excellent moisture-proofness in terms of the package construction.

REFERENCES:
patent: 4875087 (1989-10-01), Miyauchi et al.
patent: 4961106 (1990-10-01), Butt et al.
patent: 4965659 (1990-10-01), Sasame et al.
patent: 4975761 (1990-12-01), Chu
patent: 4994895 (1991-02-01), Matsuzaki et al.
patent: 5034800 (1991-07-01), Marchisi
patent: 5049977 (1991-09-01), Sako
patent: 5063434 (1991-11-01), Emoto
patent: 5089879 (1992-02-01), Komenaka

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