Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-04-03
2007-04-03
Zarneke, David A. (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257SE23080
Reexamination Certificate
active
10772252
ABSTRACT:
A semiconductor device includes a semiconductor chip, a heat dissipation member for dissipating heat generated by the semiconductor chip, and a coupling member which thermally couples the semiconductor chip to the heat dissipation member, wherein the coupling member is made of metal and deformable to absorb a stress generated between the semiconductor chip and the heat dissipation member, the coupling member and the semiconductor chip being joined through metal-metal bonding.
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European Search Report for Application No. EP 04 25 0449 dated Apr. 19, 2004.
Westerman, Hattori, Daniels & Adrian , LLP.
Zarneke David A.
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