Search
Selected: All

Fin assembly for an integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Fix base of integrated circuit chipset and heat sink

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Fixing device for securing a heat sink to a CPU module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Flexible circuit electronic package with standoffs

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Flexible surface layer film for delivery of highly filled or...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Flip chip package and method of making

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Flip chip packages with spacers separating heat sinks and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Fluid cooled encapsulated microelectronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Fluid cooled encapsulated microelectronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Fluid cooled semiconductor power module having double-sided...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Fluid-cooled power transistor arrangement

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Folded heat sink for semiconductor device package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Graphite composite heat pipe

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Grooved semiconductor die for flip-chip heat sink attachment

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Heat conductive silicone composition and semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Heat conductive substrate press-mounted in PC board hole for tra

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Heat dissipating device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Heat dissipating device package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Heat dissipation for heat generating element of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Heat dissipation plate and semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0
  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.