Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2007-03-26
2010-12-14
Mandala, Victor A (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257SE23101, C257SE23110, C257S706000, C438S118000, C438S122000
Reexamination Certificate
active
07851906
ABSTRACT:
A flexible circuit electronic package including a heat sink, a flexible circuit having a semiconductor chip positioned thereon and electrically coupled thereto, and a quantity of heat shrunk adhesive securing the flexible circuit to the heat sink such that the flexible circuit is planar. This package is then adapted for being positioned on and electrically coupled to a circuitized substrate such as a printed circuit board. A method of making this package is also provided.
REFERENCES:
patent: 5045921 (1991-09-01), Lin et al.
patent: 5170931 (1992-12-01), Desai et al.
patent: 5562517 (1996-10-01), Taylor et al.
patent: 5673479 (1997-10-01), Hawthorne
patent: 5796590 (1998-08-01), Klein
patent: 5805427 (1998-09-01), Hoffman
patent: 5896651 (1999-04-01), Hawthorne
patent: 5930889 (1999-08-01), Klein
patent: 6152756 (2000-11-01), Huang et al.
patent: 6411513 (2002-06-01), Bedard
patent: 6414849 (2002-07-01), Chiu
patent: 6444563 (2002-09-01), Potter et al.
patent: 6521990 (2003-02-01), Roh et al.
patent: 6560122 (2003-05-01), Weber
patent: 6631078 (2003-10-01), Alcoe et al.
patent: 6639360 (2003-10-01), Roberts et al.
patent: 6986454 (2006-01-01), Stillabower
patent: 7071078 (2006-07-01), Reeder et al.
patent: 7094966 (2006-08-01), Bonitz et al.
patent: 7098080 (2006-08-01), Takeuchi
patent: 7118940 (2006-10-01), Myers et al.
patent: 7153725 (2006-12-01), Wang et al.
patent: 2002/0006718 (2002-01-01), Distefano
patent: 2004/0212970 (2004-10-01), Chen et al.
“Audio Noise Suppression Techniques—Application Note AN-24”, Power Integrations, Inc., Sep., 1999, 12 pages.
“Spheriglass Solid Glass Spheres—Spacer Application Glass Beads”, Potters Industries Inc., 1 page.
“Glass Technology Today and Tomorrow—bond line spacers class VI”, Mo Sci Corporation, 1 page.
Alcoe David J.
Calmidi Varaprasad V.
Endicott Interconnect Technologies, Inc.
Fraley Lawrence R.
Hinman, Howard & Kattell
Levy Mark
Mandala Victor A
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