LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,With contact or lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Packaging and interconnection of contact structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Packaging assembly with consolidated common voltage connections

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Packaging chip and packaging method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Packaging conductive structure for a semiconductor substrate...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Packaging device for semiconductor die, semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Packaging electrical circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Packaging for high speed integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Packaging structure for ball grid array

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Pad arrangement of driver IC chip for LCD and related...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Parallel plane substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Parallel process interposer (PPI)

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Pass-through 3D interconnect for microelectronic dies and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Passive interposer including at least one passive electronic com

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

PBGA electrical noise isolation of signal traces

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Perimeter independent precision locating member

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

PGA package type semiconductor device having leads to be supplie

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Photo-interrupter and semiconductor device using the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Pin arrangement for high frequency integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Pin array set-up device