LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package,With contact or lead

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Microelectronic assemblies with multiple leads

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Microelectronic assemblies with springs

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Microelectronic assembly fabrication with terminal formation...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Microelectronic complex having clustered conductive members

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Microelectronic component with rigid interposer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Microelectronic component with rigid interposer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Microelectronic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Microelectronic devices and methods for manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Microelectronic mounting with multiple lead deformation and bond

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Microelectronic mounting with multiple lead deformation...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Microelectronic mounting with multiple lead deformation...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Microelectronic package and method of manufacturing same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Microelectronic package with carbon nanotubes interconnect...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Microelectronic packaging and methods for thermally...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Microelectronic spring contact elements

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Microelectronics package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Micromachined chip scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Micromachined chip scale package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Micromachined chip scale package