Microelectronic package with carbon nanotubes interconnect...

Details Microelectronic package with carbon nanotubes interconnect... Microelectronic package with carbon nanotubes interconnect...

2011-08-23

2011-08-23

Andújar, Leonardo (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C438S107000

Reexamination Certificate

active

08004076

ABSTRACT:
A method of forming a microelectronic package is provided. The method includes providing a silicon substrate having a plurality of carbon nanotubes disposed on a silicon layer and coupling the silicon substrate to a top surface of a packaging substrate, wherein the plurality of carbon nanotubes are coupled to a plurality of substrate pads of the packaging substrate. The method also includes removing the silicon substrate from the packaging substrate and disposing a die adjacent to the top surface of the packaging substrate, wherein the plurality of carbon nanotubes are coupled to a plurality of bump pads of the die.

REFERENCES:
patent: 6989325 (2006-01-01), Uang et al.
patent: 2008/0227294 (2008-09-01), Suh
patent: 2009049162 (2009-03-01), None

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