Microelectronic assemblies with springs

Details Microelectronic assemblies with springs Microelectronic assemblies with springs

2007-12-04

2007-12-04

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S722000

Reexamination Certificate

active

10901407

ABSTRACT:
A microelectronic element such as a semiconductor chip has springs such as coil springs bonded to contacts so that the springs serve as electrical connections to a circuit panel. The unit can be tested readily and can be surface-mounted to a circuit panel by bonding the distal ends of the springs, remote from the microelectronic element, to the panel. The springs can also serve as antennas so as to provide a miniaturized phased array.

REFERENCES:
patent: 5794330 (1998-08-01), Distefano et al.
patent: 5917707 (1999-06-01), Khandros et al.
patent: 6778406 (2004-08-01), Eldridge et al.
patent: 6965245 (2005-11-01), Kister et al.

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