Microelectronic component with rigid interposer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

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Details

257693, 257778, 257705, H01L 2348, H01L 2306, H01L 2352

Patent

active

060021683

ABSTRACT:
A microelectronic component for mounting a rigid substrate, such as a hybrid circuit to a rigid support substrate, such as a printed circuit board. The microelectronic component includes a rigid interposer which may have a chip mounted on its first surface; a pattern of contacts on the rigid interposer; a flexible interposer overlying the second surface of the rigid interposer; a pattern of terminals on the flexible interposer; flexible leads; and solder coated copper balls mounted on the flexible interposer. The microelectronic component may have a socket assembly mounted on the first surface of the rigid interposer. The microelectronic component may be mounted on a rigid support substrate.

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IMB Technical Disclosure Bulletin, "Chip Column Package Structure", vol. 40 No. 08 Aug. 1997. p 117 (257/696).

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