Microelectronic devices and methods for manufacturing...

Details Microelectronic devices and methods for manufacturing... Microelectronic devices and methods for manufacturing...

2011-01-04

2011-01-04

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S787000, C257SE23011

Reexamination Certificate

active

07863727

ABSTRACT:
Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. In one embodiment, a microelectronic device includes a microelectronic die, a plurality of electrical couplers projecting from the die, and a flowable material disposed on the die. The die includes an integrated circuit and a plurality of terminals operably coupled to the integrated circuit. The electrical couplers are attached to corresponding terminals on the die. The flowable material includes a plurality of spacer elements sized to space the die apart from another component. The flowable material may be a no-flow underfill, a flux compound, or other suitable material.

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