Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent
1998-09-17
2000-09-26
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
257 48, 257621, H01L 2358, H01L 2304, H01L 2940
Patent
active
061246344
ABSTRACT:
A chip scale package comprised of a semiconductor die having a silicon blank laminated to its active surface. The bond pads of the die are accessed through apertures micromachined through the blank. The package may be employed with wire bonds, or solder or other conductive bumps may be placed in the blank apertures for flip-chip applications. Further, the package may be employed to reroute external connections of the die to other locations, such as a centralized ball grid array or in an edge-connect arrangement for direct or discrete die connect (DDC) to a carrier. It is preferred that the chip scale package be formed at the wafer level, as one of a multitude of packages so formed with a wafer-level blank, and that the entire wafer be burned-in and tested to identify the known good die (KGD) before the wafer laminate is separated into individual packages.
REFERENCES:
patent: 4542397 (1985-09-01), Biegelsen et al.
patent: 5018002 (1991-05-01), Neugebauer et al.
patent: 5136364 (1992-08-01), Byrne
patent: 5248797 (1993-09-01), Sum
patent: 5248903 (1993-09-01), Heim
patent: 5258648 (1993-11-01), Lin
patent: 5262927 (1993-11-01), Chia et al.
patent: 5291064 (1994-03-01), Kurokawa
patent: 5424652 (1995-06-01), Hembree et al.
patent: 5441917 (1995-08-01), Rostoker et al.
patent: 5468681 (1995-11-01), Pasch
patent: 5481135 (1996-01-01), Chandra et al.
patent: 5508230 (1996-04-01), Anderson et al.
patent: 5553769 (1996-09-01), Ellerson et al.
patent: 5579573 (1996-12-01), Baker et al.
patent: 5629241 (1997-05-01), Matloubian et al.
patent: 5814889 (1998-09-01), Gaul
patent: 5821624 (1998-10-01), Pasch
patent: 5856705 (1999-01-01), Ting
Akram Salman
Farnworth Warren M.
Hembree David R.
Clark Jhihan B.
Micro)n Technology, Inc.
Saadat Mahshid
LandOfFree
Micromachined chip scale package does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Micromachined chip scale package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Micromachined chip scale package will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2102528