Article comprising a multi-layer electronic package and...
Article comprising a superconducting RF filter
Article having metal impregnated within carbon nanotube array
Assemblies and multi-chip modules including stacked...
Assemblies and packages including die-to-die connections
Assemblies having stacked semiconductor chips and methods of...
Assemblies having stacked semiconductor chips and methods of...
Assembly for stacked BGA packages
Assembly of plurality of semiconductor devices
Assembly package with stacked dies and signal transmission...
Back-to-back semiconductor device assemblies
Ball grid array package construction with raised solder ball...
Ball grid array package stacking system
Ball grid array package with shielding
Ball grid array package with stacked center pad chips and...
Ball grid array package, stacked semiconductor package and...
Ball grid array packages for high speed applications
Ball grid array substrate having window and method of...
Barrier structure against corrosion and contamination in...
Bond pad rerouting element, rerouted semiconductor devices...