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Microcircuit via interconnect

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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Microelectronic connection components utilizing conductive...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Microelectronic device packages, stacked microelectronic...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Microelectronic die packages with metal leads, including...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Microelectronic multi-chip module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
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Microelectronic package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Microelectronic package array

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Microelectronic package having solder-filled through-vias

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Microelectronic packages having cavities for receiving...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Micromirror device package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Miniature semiconductor package for opto-electronic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Miniaturized multi-chip module and method for manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Modular three-dimensional chip multiprocessor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Module assembly for stacked BGA packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Module assembly for stacked BGA packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Module card structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Module device of stacked semiconductor packages and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Module having stacked chip scale semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Module having stacked chip scale semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Module mounted with semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent

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