Module mounted with semiconductor device

Details Module mounted with semiconductor device Module mounted with semiconductor device

1997-12-16

1999-09-07

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257723, 257777, H01L 2302

Patent

active

059491353

ABSTRACT:
A module mounted in relative high density with semiconductor devices is disclosed. The module includes a mounting substrate which has a hole section; a first semiconductor device having bump electrodes which protrude from one principal surface of a package and lead terminals electrically connected to the bump electrodes; a second semiconductor device which also has bump electrodes that can be structurally and electrically coupled with the bump electrodes of the first semiconductor device and where this second semiconductor device is able to be located in the hole section of the mounting substrate, and where the first semiconductor device is able to be supported on the mounting substrate through the lead terminals; and where the bump electrodes of both semiconductor devices are electrically connected to each other.

REFERENCES:
patent: 5614766 (1997-03-01), Takasu et al.
patent: 5744862 (1998-04-01), Ishii

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