Microelectronic package having solder-filled through-vias

Details Microelectronic package having solder-filled through-vias Microelectronic package having solder-filled through-vias

2006-06-02

2009-12-29

Nguyen, Cuong Q (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000, C257S778000

Reexamination Certificate

active

07638867

ABSTRACT:
An apparatus, a method, and a system associated with microelectronic packaging are disclosed herein. In various embodiments, a microelectronic package may include a die having one or more through-vias, each filled with a solder material; a substrate; and one or more solder bumps disposed between and electrically connecting the substrate and a backside of the die.

REFERENCES:
patent: 5557150 (1996-09-01), Variot et al.
patent: 5869894 (1999-02-01), Degani et al.
patent: 6407456 (2002-06-01), Ball
patent: 6731189 (2004-05-01), Puzella et al.
patent: 6746897 (2004-06-01), Fukutomi et al.
patent: 6812549 (2004-11-01), Umetsu et al.
patent: 6828512 (2004-12-01), Chung et al.
patent: 6933613 (2005-08-01), Akashi
patent: 6998709 (2006-02-01), Khorram
patent: 2004/0113261 (2004-06-01), Sunohara et al.

Affiliated with

Also associated with

Rating

Microelectronic package having solder-filled through-vias does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microelectronic package having solder-filled through-vias, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microelectronic package having solder-filled through-vias will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4090150