Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2009-01-12
2011-10-04
Zarneke, David A (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S723000, C257SE25006, C257SE25013, C257SE25021, C257SE25027
Reexamination Certificate
active
08030748
ABSTRACT:
A stackable microelectronic package includes a first microelectronic die attached to and electrically connecting with a first substrate. A second microelectronic die is attached to the first die on one side, and to a second substrate on the other side. Electrical connections are made between the first die and the first substrate, between the second die and the second substrate, and between the first and second substrates, e.g., via wire bonding. The electrical connecting elements are advantageously encased in a molding compound. Exposed contacts on the first and/or second substrates, not covered by the molding compound, provide for electrical connections between the package, and another package stacked onto the package. The package may avoid coplanarity factors, can be manufactured using existing equipment, allows for intermediate testing, and can also offer a thinner package height.
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Chong Chin Hui
Ye Seng Kim Dalson
Micro)n Technology, Inc.
Perkins Coie LLP
Zarneke David A
LandOfFree
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