Miniaturized multi-chip module and method for manufacturing...

Details Miniaturized multi-chip module and method for manufacturing... Miniaturized multi-chip module and method for manufacturing...

2007-12-25

2007-12-25

Clark, S. V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000, C438S109000

Reexamination Certificate

active

11206843

ABSTRACT:
A miniaturized multi-chip module suitable for application to wireless transmission devices includes a substrate, integrated circuit chips mounted on and connected electrically to the substrate, and an interposer mounted on one surface of the substrate. The interposer cooperates with the substrate to confine a receiving space for receiving the integrated circuit chips on the surface of the substrate to which the interposer is attached, and is provided with conductors that are connected electrically to the substrate. Therefore, when the interposer is mounted on a circuit board, the conductors serve as external electrical connections for the integrated circuit chips. A method for manufacturing the miniaturized multi-chip module is also disclosed.

REFERENCES:
patent: 6737742 (2004-05-01), Sweterlitsch
patent: 7034387 (2006-04-01), Karnezos
patent: 7180165 (2007-02-01), Ellsberry et al.
patent: 7217994 (2007-05-01), Zhu et al.
patent: 7247932 (2007-07-01), Lin et al.

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