Microelectronic package

Details Microelectronic package Microelectronic package

2006-08-16

2009-12-29

Smith, Zandra (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE23169

Reexamination Certificate

active

07638868

ABSTRACT:
A microelectronic package includes a lower unit having a lower unit substrate with conductive features and a top and bottom surface. The lower unit includes one or more lower unit chips overlying the top surface of the lower unit substrate that are electrically connected to the conductive features of the lower unit substrate. The microelectronic package also includes an upper unit including an upper unit substrate having conductive features, top and bottom surfaces and a hole extending between such top and bottom surfaces. The upper unit further includes one or more upper unit chips overlying the top surface of the upper unit substrate and electrically connected to the conductive features of the upper unit substrate by connections extending within the hole.

REFERENCES:
patent: 4878611 (1989-11-01), LoVasco et al.
patent: 5222014 (1993-06-01), Lin
patent: 5247423 (1993-09-01), Lin et al.
patent: 5998864 (1999-12-01), Khandros et al.
patent: 6445594 (2002-09-01), Nakagawa et al.
patent: 6765287 (2004-07-01), Lin et al.
patent: 2002/0043709 (2002-04-01), Yeh et al.
patent: 2002/0053727 (2002-05-01), Kimura
patent: 2002/0074630 (2002-06-01), Ando et al.
patent: 2002/0121687 (2002-09-01), Winderl
patent: 2002/0190396 (2002-12-01), Brand
patent: 2003/0102546 (2003-06-01), Lee et al.
patent: 2003/0183930 (2003-10-01), Fukasawa
patent: 2004/0026773 (2004-02-01), Koon et al.
patent: 2004/0090759 (2004-05-01), Kim
patent: 2005/0104196 (2005-05-01), Kashiwazaki
patent: 2005/0284658 (2005-12-01), Kubota et al.
patent: 2005/0285246 (2005-12-01), Haba et al.
patent: 2006/0202317 (2006-09-01), Barakat et al.
patent: 2006/0290005 (2006-12-01), Thomas et al.
patent: 10023823 (2001-12-01), None
patent: 0 615 283 (1994-09-01), None
patent: 2007075678 (2007-07-01), None
International Search Report, PCT/US2007/018521.

Affiliated with

Also associated with

Rating

Microelectronic package does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microelectronic package, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microelectronic package will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4147609