Microcircuit via interconnect

Details Microcircuit via interconnect Microcircuit via interconnect

1996-11-05

1998-02-10

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257700, 257774, H01L 2348

Patent

active

057172471

ABSTRACT:
A method for forming a conductive vias in a non-conductive substrate having a through-hole formed therein intermediate two side thereof. The method utilizes the steps of: applying gold paste to the through-hole so as to provide electrical conduction therethrough; and under firing the gold paste when a thin conductive film is present upon the substrate and fully firing the gold paste when no thin conductive film is present on the substrate. Under firing the gold paste when a thin-film is present upon the substrate prevents degradation of the thin conductive film. Subsequent processing of the gold paste assures the integrity and reliability thereof. Thus, the gold paste provides enhanced conductivity and improved reliability, as compared to contemporary thin-film vias.

REFERENCES:
patent: 3648131 (1972-03-01), Stuby
patent: 4499655 (1985-02-01), Anthony
patent: 4534100 (1985-08-01), Lane
patent: 4784970 (1988-11-01), Solomon
patent: 4794092 (1988-12-01), Solomon
patent: 4830878 (1989-05-01), Kaneko et al.
patent: 4907128 (1990-03-01), Solomon et al.
patent: 4954458 (1990-09-01), Reid
patent: 4988641 (1991-01-01), Solomon
patent: 4992908 (1991-02-01), Solomon
patent: 5010025 (1991-04-01), Solomon
patent: 5013687 (1991-05-01), Solomon
patent: 5013919 (1991-05-01), Solomon
patent: 5030828 (1991-07-01), Solomon
patent: 5036203 (1991-07-01), Solomon
patent: 5045907 (1991-09-01), Solomon
patent: 5053350 (1991-10-01), Solomon
patent: 5064771 (1991-11-01), Solomon
patent: 5067233 (1991-11-01), Solomon
patent: 5075201 (1991-12-01), Koh
patent: 5075238 (1991-12-01), Solomon
patent: 5093708 (1992-03-01), Solomon
patent: 5108938 (1992-04-01), Solomon
patent: 5122851 (1992-06-01), Solomon
patent: 5128749 (1992-07-01), Hornback et al.
patent: 5135556 (1992-08-01), Horback et al.
patent: 5138164 (1992-08-01), Koh
patent: 5149671 (1992-09-01), Koh et al.
patent: 5166097 (1992-11-01), Tanielian
patent: 5198695 (1993-03-01), Hanes et al.
patent: 5208478 (1993-05-01), Solomon
patent: 5209798 (1993-05-01), Solomon et al.
patent: 5231304 (1993-07-01), Solomon
patent: 5285570 (1994-02-01), Fulinaran
patent: 5292624 (1994-03-01), Wei
patent: 5315147 (1994-05-01), Solomon
patent: 5334558 (1994-08-01), Dietz et al.
patent: 5365790 (1994-11-01), Chen et al.
patent: 5393696 (1995-02-01), Koh et al.
patent: 5399898 (1995-03-01), Rostoker
patent: 5450290 (1995-09-01), Boyko et al.
patent: 5496619 (1996-03-01), Itagaki et al.
patent: 5510655 (1996-04-01), Tanielian
patent: 5627406 (1997-05-01), Pace

Affiliated with

Also associated with

Rating

Microcircuit via interconnect does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Microcircuit via interconnect, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Microcircuit via interconnect will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2079354