Microelectronic packages having cavities for receiving...

Details Microelectronic packages having cavities for receiving... Microelectronic packages having cavities for receiving...

2011-08-09

2011-08-09

Williams, Alexander O (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257SE23001, C257SE21499, C257S697000, C257S685000, C257S723000, C257S777000, C257S774000, C257S773000, C257S784000, C257S786000, C257S680000

Reexamination Certificate

active

07994622

ABSTRACT:
Packaged microelectronic elements are provided which include a dielectric element, a cavity, a plurality of chip contacts and a plurality of package contacts, and microelectronic elements having a plurality of bond pads connected to the chip contacts.

REFERENCES:
patent: 7196408 (2007-03-01), Yang et al.
patent: 7547965 (2009-06-01), Hsu
patent: 2006/0006534 (2006-01-01), Yean et al.
patent: 2007/0152310 (2007-07-01), Osborn et al.
patent: 2008/0217761 (2008-09-01), Yang et al.
patent: 2008/0248614 (2008-10-01), Yang et al.
patent: 2008/0274593 (2008-11-01), Yang et al.
patent: 2009/0057873 (2009-03-01), Hsu

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