Microelectronic multi-chip module

Details Microelectronic multi-chip module Microelectronic multi-chip module

2007-06-26

2007-06-26

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S686000, C257S777000, C257SE25021, C257SE25027, C257SE23085, C438S109000, C438S508000

Reexamination Certificate

active

11027091

ABSTRACT:
A method of fabricating a microelectronic multi-chip module comprises: providing a cavity down ball grid array having a die and solder balls on a die side thereof; providing a package including at least one die thereon on a die side thereof; stacking the package onto the backside of the ball grid array opposite from the die side of the ball grid array. The backsides of the ball grid array and of the package may include land pads for providing interconnection between the ball grid array and the package during stacking.

REFERENCES:
patent: 6462421 (2002-10-01), Hsu et al.
patent: 6495910 (2002-12-01), Wu
patent: 6583503 (2003-06-01), Akram et al.
patent: 6633078 (2003-10-01), Hamaguchi et al.
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patent: 6734539 (2004-05-01), Degani et al.
patent: 6781241 (2004-08-01), Nishimura et al.
patent: 6838761 (2005-01-01), Karnezos
patent: 6927485 (2005-08-01), Lai et al.
patent: 2002/0030261 (2002-03-01), Rolda et al.
patent: 2003/0132519 (2003-07-01), Huang

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