Module card structure

Details Module card structure Module card structure

2007-06-19

2007-06-19

Nguyen, Cuong (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S738000, C257S778000, C257S783000

Reexamination Certificate

active

11066525

ABSTRACT:
A module card structure includes a structure, a first chip, a second chip, an adhesive layer, and a compound layer. The substrate has an upper surface on which a plurality of golden fingers are formed, and a lower surface. The first chip is mounted on the upper surface of the substrate and is electrically connected to the golden fingers by first wires. The second chip is adhered to the upper surface of the substrate by the adhesive layer, which includes glue and filling elements, and is electrically connected to the golden fingers by second wires. The compound layer is encapsulated on the first chip and the second chip.

REFERENCES:
patent: 5564617 (1996-10-01), Degani et al.
patent: 6650009 (2003-11-01), Her et al.
patent: 6924171 (2005-08-01), Buchwalter et al.

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