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Chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Chip package structure and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Chip package structure with dual heat sinks

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Chip packaging system and method using deposited diamond film

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Chip type varistor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Chip-scale packaged pressure sensor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Chip-size integrated circuit package having slits formed in...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Chip-type electronic component having external electrodes...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Circuit assembly with polyimide insulator

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Circuit board

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Circuit board-providing article, circuit board,...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Circuit device and manufacturing method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Circuit film utilizing a power supply and ground connections

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Circuit module turbulence enhancement systems and methods

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Circuit module with thermal casing systems

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Circuit module with thermal casing systems

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Circuit substrate including insulating layer of aluminum nitride

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Circuits, multi-layer circuits, and methods of manufacture...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Clip mount for integrated circuit leadframes

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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