Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2008-10-13
2011-10-11
Chu, Chris (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257SE23031, C257S676000, C257S690000, C438S106000, C438S125000
Reexamination Certificate
active
08035221
ABSTRACT:
A leadframe having a die thereon connects a high current conductive area on the die to a leadframe contact using a copper clip that include a structural portion that is received within a recess-like “tub” that is formed in the leadframe contact which tub is shaped to conform to the geometric shape of the clip. In the preferred embodiment, a leadframe structure fabricated by etching includes at least one contact that is a halfetch recess or “tub” that receives one end of the clip structure and is retained in the tub by an adhesive. The end of the clip that is received in the tub is held in place during subsequent handling until the clip and leadframe undergo solder reflow to effect an electrical connection sufficient to handle the current load and also effect a reliable mechanical connection.
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patent: 2009/0121330 (2009-05-01), Cruz
Chu Chris
Intersil America's Inc.
Walter Wallace G.
LandOfFree
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