Circuit assembly with polyimide insulator

Details Circuit assembly with polyimide insulator Circuit assembly with polyimide insulator

1991-12-19

1994-04-12

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257643, 257759, H01L 3902

Patent

active

053028511

ABSTRACT:
The present invention relates to a circuit assembly comprising the polyimide poly(3,4'-oxydiphenylene pyromellitimide).

REFERENCES:
patent: 4489364 (1984-12-01), Chance et al.
patent: 4508981 (1985-04-01), Dorler et al.
patent: 4628411 (1986-12-01), Balderes et al.
patent: 4640972 (1987-02-01), Irwin
patent: 4811082 (1989-03-01), Jacobs et al.
patent: 4847353 (1989-07-01), Watanabe

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