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Stackable vertical thin package/plastic molded lead-on-chip memo

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Stacked semiconductor package and method of manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Stiffener for flip chip BGA package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Stiffener ring attachment with holes and removable snap-in heat

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Stiffeners with improved adhesion to flexible substrates

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Stress relieving film for semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Structural reinforcement for electronic substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Structure and material for assembling a low-K Si die to...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Structure and method for improved heat conduction for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Structure and method for improved heat conduction for...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Structure and method of making capped chips including...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Structure and methods of processing for solder thermal...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Structure for reducing die corner and edge stresses in...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Structure for reinforcing a semiconductor device to prevent...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Structure for semiconductor package for improving the efficiency

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Structures and methods for heat dissipation of semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Structures for improving heat dissipation in stacked...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Structures to enhance cooling of computer memory modules

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Subassembly that includes a power semiconductor die and a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Substrate for resin-encapsulated semiconductor device,...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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