Structure for semiconductor package for improving the efficiency

Details Structure for semiconductor package for improving the efficiency Structure for semiconductor package for improving the efficiency

1998-05-12

1999-05-11

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257 737, 257738, 257712, 257797, 257713, H01L23/495;23/12

Patent

active

059030526

ABSTRACT:
The present invention includes a substrate having a first opening. A heat spreader is attached on the bottom surface of the substrate. The bottom side surface of the heat spreader has trench pattern. The trench pattern includes a plurality of connecting cavities and a plurality of trenches. The chip is mounted on the top side surface of the heat spreader. A supporting member is formed on the top side surface of the substrate. The space among the substrate, the chip, the heat spreader and the supporting member is encapsulated by encapsulating material. The preformed solder balls are mounted on the bottom side surface of the substrate.

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patent: 5717252 (1998-02-01), Nakashima et al.
patent: 5760465 (1998-06-01), Alcoe et al.

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