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Method for fabricating a lid for a wafer level packaged...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Method for fabricating an ultralow dielectric constant...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Method for manufacturing bump leaded film carrier type semicondu

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Method for sealing a semiconductor device and apparatus...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Method of assembling a ball grid array package with...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Method of embedding semiconductor chip in support plate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Method of fabricating an apparatus including a sealed cavity

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Method of increasing package reliability using package lids with

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Method of making a semiconductor diode from laminated ceramic ta

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Method of manufacturing a dielectric film in a capacitor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Method of manufacturing a plurality of semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Method of removing free halogen from a halogenated polymer...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Method of solder bonding and power semiconductor device manufact

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Methods for packing microfeature devices and microfeature...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Methods of fabrication of wafer-level vacuum packaged devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Methods of promoting adhesion between transfer molded IC...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Microcap wafer-level package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Microelectromechanical system package with environmental and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Microelectromechanical systems using thermocompression bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Microelectromechanical systems using thermocompression bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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