Method of increasing package reliability using package lids with

Details Method of increasing package reliability using package lids with Method of increasing package reliability using package lids with

1996-11-08

1998-11-17

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257680, 257703, 257705, 257678, H01L 2312, H01L 2306, H01L 2310, H01L 2302

Patent

active

058380639

ABSTRACT:
A lid for a chip/package system includes a body sized to fit over an integrated circuit chip and being connectable to a package. The body has at least two regions exhibiting different coefficients of thermal expansion, with one CTE matching that of the chip and the other matching that of the package.

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"Electronic Packaging and Interconnection Hanbook" C. Harper, pp. 1.35, 1.59, Nov. 1992.
"Decal with Power/Ground Plane Partitioned by Thermal Coefficient of Expansion" IBM Tech. Discl. Blt. vol. 32, No.4b, 1 Sep. 1989, pp. 436-437.
"Thermally Compatible Cap/Heatsink Unit" IBM Tech. Discl. Bit. vol. 32, No. 4A, Sep. 1989, pp. 352-353.

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