Method of embedding semiconductor chip in support plate

Details Method of embedding semiconductor chip in support plate Method of embedding semiconductor chip in support plate

2007-09-25

2007-09-25

Chambliss, Alonzo (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S703000, C257S783000, C257S789000, C257SE23016

Reexamination Certificate

active

11510604

ABSTRACT:
A method of embedding a semiconductor chip in a support plate and an embedded structure thereof are proposed. A first dielectric layer having a reinforced filling material is provided, and a semiconductor chip is mounted on the first dielectric layer. A support plate having an opening and a second dielectric layer having a reinforced filling material are provided. The first dielectric layer mounted with the semiconductor chip, the support plate, and the second dielectric layer are pressed together, such that the semiconductor chip is received in the opening of the support plate, and the dielectric layers fill in a gap between the semiconductor chip and the opening of the support plate. The reinforced filling material of the dielectric layers can maintain flatness and consistency of the semiconductor chip embedded in the support plate, and fine circuits can be fabricated on the support plate by build-up and electroplating processes.

REFERENCES:
patent: 4918811 (1990-04-01), Eichelberger et al.
patent: 5682066 (1997-10-01), Gamota et al.
patent: 6586276 (2003-07-01), Towle et al.
patent: 6876554 (2005-04-01), Inagaki et al.
patent: 6964887 (2005-11-01), Akagawa
patent: 6991966 (2006-01-01), Tuominen
patent: 7129117 (2006-10-01), Hsu
patent: 2003/0183418 (2003-10-01), Castro et al.

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