Method for manufacturing bump leaded film carrier type semicondu

Details Method for manufacturing bump leaded film carrier type semicondu Method for manufacturing bump leaded film carrier type semicondu

1997-06-12

1999-05-18

Martin-Wallace, Valencia

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257778, H01L23/48

Patent

active

059053038

ABSTRACT:
An insulating film has conductive layers on a first surface and conductive protrusions on a second surface. The conductive layers are connected to the conductive protrusions via through holes provided in the insulating film. A semiconductor chip having pads is adhered by an adhesive layer to the insulating film. Then, the conductive layers are locally pressured, so that the conductive layers are electrically connected to respective ones of the pads.

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Rao R. Tummala et al., "Microelectronics Packaging Hand-book", pp. 419-423, Van Nostrand Reinhold, New York, 1989.

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